TM 11-6625-3081-23
2-19. SURFACE PREPARATION (cont)
2-19
1. GROUND LEAD BONDING
CAUTION
Do not allow cleaning materials to
touch painted markings, such as E2
and GND as shown.
Markings could
become unreadable.
NOTE
This procedure is used to prepare
a low-resistance bonding surface
of less than one ohm to be used
for installation of a ground
lead.
Do not remove any more metal sur-
face than is necessary to achieve
a smooth bonding surface.
a.
On bonding surface (1), use emery
paper and sand bonding surface
until metal is bare, at least
0.75 inch diameter around the
ground hole.
WARNING
TRICHLOROTRIFLUOROETHANE
TOXIC, IRRITATING. CAN CAUSE
BREATHING PROBLEMS, EYE DAMAGE.
DON’T:
LET IT GET ON SKIN, OR
BREATHE VAPORS.
DO:
USE IN WELL-VENTILATED AREA,
CLOSE CONTAINERS WHEN NOT USING.
WEAR ACID-TYPE SAFETY GOGGLES,
RUBBER GLOVES, AND RUBBER APRON.
IF IT CONTACTS SKIN OR EYES, WASH
AFFECTED AREAS WITH RUNNING WATER.
GET MEDICAL HELP AT ONCE.
IF YOU EXPERIENCE ANY BREATHING
PROBLEMS, GET TO FRESH AIR AT
ONCE.
b.
Using cheesecloth pad and tri-
chlorotrifluoroethane, clean
bonding surface (1).
c.
Let bonding surface air dry.
2-153
