TM 11-6625-3081-23
Section XII.
PREPARATION FOR STORAGE OR SHIPMENT
Subject
Para
Page
General
. . . . . . . . . . . . . . . . . . . . . . . .
2-70
2-323
Special Packaging Procedures - Assemblies that Contain
ESDS Devices. . . . . . . . . . . . . . . . . . . . . . . . , . 2-71
2-323
Transport Retainer Procedures . . . . . . . . . . . . . . . . . . 2-72
2-325
Disk/Tape Drive Storage and Shipment Procedure . . . . . . . . . . 2-73
2-327
2-70. GENERAL
2-70
Preparation for storage or shipment of EETF TADS PNVS Augmentation Equipment
(assemblies/subassemblies) should be done per Department of Defense (DOD) standards.
There are no special handling procedures for the assemblies/subassemblies except for
electrostatic discharge sensitive (ESDS) circuit card assemblies (CCAs) as
identified in the following paragraph.
When the EETF is moved, the electro-optical test bench set must be secured by
transport retainer brackets.
Procedures for positioning these brackets are provided
in paragraph 2-72.
2-71.
SPECIAL PACKAGING PROCEDURES - ASSEMBLIES THAT CONTAIN ESDS DEVICES
2-71
This paragraph provides information for specific packaging of ESDS CCAs. These
CCAs contain devices that are sensitive to damage by electrostatic discharge (ESD).
Maintenance, shop handling, and initial packaging instructions for ESDS CCAs are con-
tained in paragraph 2-21.
Refer to DOD-STD-1686 for information that covers
packaging ESDS device symbol marking, and standard ESDS warnings. The following
list identifies the ESDS CCAs used in this equipment. Be sure that they are
handled, packaged, and shipped properly.
Change 9
2-323
